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ESI 5330 Laser drilling machine3
Home Products 雷射專孔機 軟板專用 ESI 5330 Laser drilling machine
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ESI 5330 Laser drilling machine

ESI’s model 5330 UV laser µvia drill incorporates a high-power diode-pumped laser with pulse repetition frequency of up to 70 kHz and can cut copper with excellent quality and productivity rates of up to 15,000 vias per minute.

The ESI 5330 enables customers the shrink pad design for increased density of circuit boards and electronic packages.
ESI’s model 5330 UV laser µvia drill incorporates a high-power diode-pumped laser with pulse repetition frequency of up to 70 kHz and can cut copper with excellent quality and productivity rates of up to 15,000 vias per minute.
The system is designed with the capability to have various optical configurations to meet the needs of HDI and IC packaging markets.
The optional shaped-beam capability guarantees excellent quality, improves registration, and produces highly circular vias, high throughput, and excellent bottom copper quality with no resin residue.
No external water or gas is needed, allowing for easy installation and low operating costs.

The Model 5330 is an addition to the 5300 family of UV and CO2 laser drills, a platform that delivers high accuracy to +/- 10 microns.

The 5300 family of laser drills have been designed to protect the manufacturer's initial capital investment through cost effective field upgrades.
For example, the system architecture allows for the latest model laser, optical bench or galvanometer to be replaced at customer site as newer technology is introduced in the market.

軟板專用 1433063